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  • BPC8219 Backplane Features
  • BPC8219 Backplane Tech Specs
  • BPC8219 Backplane Download Documents
The BPC8219 PCI Express Backplane

The BPC8219 PCI Express Backplane

Side A also includes a 16-port/64-Lane PCIe 2.0 switch, a GbE port, and four USB interfaces, while three x16 PCIe slots on side B are each driven with a x16 PCIe Gen2 link from the switch.  The PCIe switch receives its x16 PCIe root complex link from a standard PICMG® 1.3 SBC such as a Trenton TSB7053, BXT7059, or TQ9.

The BPC8219 PCI Express backplane is designed and manufactured in our ISO 9001:2008 registered facilities and supported from within the USA.  This butterfly form factor PCI Express backplane is supported by Trenton’s 5-year factory warranty.

Key Features

Key Features

Key features of the BPC8219 PCI Express backplane include:

  • 2U butterfly form factor backplane supports a wide variety of 2U chassis designs
  • Side A supports one PICMG 1.3 single board computer
  • Side B includes three x16 PCIe slots driven with x16 links from a 16-port/64-Lane PCI Express 2.0 switch
  • Side A also supports one x16 PCI Express slot driven by a x4 PCIe link from the SBC
  • One 10/100/1000Base-T Ethernet port is available on side A
  • Four USB interfaces are available on side A
  • PICMG 1.3 backplane optimized for use with vertical ATX/EPS and +12 AUX power connectors

Tech Specs

Model Number


Form Factor

2U Butterfly, one segment


Board dimensions: 13.067″ x 3.307″

The nominal backplane thickness is 0.080”; however, the backplane mounting holes are recessed 0.018” on the bottom to provide an effective PCB thickness of 0.062” for use in the chassis design process.


PCI Express Slots – Side A
One, x4 PCIe slot (x16 mechanical) driven directly from SBC

PCI Express Slots – Side B
Three, x16 PCIe slots (x16 mechanical) driven from a 64-Lane, 16-Port PCIe Gen2 switch

See datasheet or mechanical layout diagram for detailed slot routing information.


3.307″ x 13.067″
(2U Butterfly)

Card Slots

Side A
1 – x4 PCI Express 2.0/1.1 electrical / x16 mech. connector
Side B
3 – x16 PCI Express 2.0/1.1 electrical / x16 mech. connector

Suggested SHB/SBCs

Dual-processor SBCs: BXT7059, JXT6966

Single-processor SBCs: TSB7053, TQ9, BXTS7059, JXTS6966

SHB Configuration

PICMG 1.3 Combo or Graphics Class

Agency Approvals & Compliance

Designed to meet UL60950, CAN/CSA C22.2 No. 60950-00, EN55022: 1998 Class B, EN61000-4-2:1995

Power Connectors

The BPC8219 backplane design is optimized for use in 2U rackmount computers with vertical power connectors suitable for use with either an ATX or EPS power supply as well as the +12V AUX power input.

Contact Trenton for additional information on optional right-angle backplane power connectors.

Power Indicators

Diagnostic LEDs for 1V, 2.5V, 3.3V, 5V, 5V AUX, and 12V power connections


Operating Temp:  0°C to 60°C

Storage Temp: -40° to 70°C

Humidity: 5% to 90% non-condensing

The Trenton BPC8219 is a lead free, RoHS compliant backplane.

Need pricing for the BPC8219 backplane?

U.S. Design & Assembly

U.S. Design & Assembly

Years in Business

Years in Business

Year Warranty

Year Warranty

Year Product Life Cycle

Year Product Life Cycle

The Trenton Difference

Trenton Systems designs, manufactures and integrates rugged computers and long-life components such as single board computers and PCI Express backplanes to create application-ready computing solutions that satisfy our customers' unique requirements for functionality, performance and reliability.