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  • BPG7087 Backplane Features
  • BPG7087 Backplane Tech Specs
  • BPG7087 Backplane Download Documents

The BPG7087 PCI Express Backplane

The BPG7087 PCI Express backplane features four x16 PCI Express electrical interface links that enable system designers to support multiple high-end video or GPU cards in a single rackmount computer system.  The other six option card slots use x16 PCIe mechanical connectors driven with x4 PCIe electrical links when using a single-processor TSB7053 single board computer or a dual-processor BXT7059 SBC with either SBC using the optional IOB33 expansion module.
 

PCIe links integrated into the CPUs on both of these SBCs automatically match an option card’s PCI Express link type and speed via the interface’s built-in auto-training capability.  This SBC and backplane design feature maximizes system flexibility by enabling system support for standard PCI Express 3.0, 2.0 or 1.1 option cards having various PCIe electrical interfaces such as x16, x8, x4 and x1 PCIe links.

Key Features

Key Features

Key features of the BPG7087 PCI Express backplane include:
 

  • Ideal PCI Express backplane for video processing and GPU computing
  • Features multiple x16 PCI Express 2.0 option card slots
  • Supports multiple NVIDIA® Tesla® 20-series GPU cards
  • Supports up to nine Matrox® Mura™ MPX Series video wall controller cards
  • Ten total PCIe 2.0 option card slots available in PCI Express backplane applications
    • 4 – x16 PCI Express 2.0/1.1 electrical / x16 mech. connectors
    • 4 – x4 PCI Express 2.0/1.1 electrical / x16 mech. connectors
    • 1 – x4 PCI Express 2.0/1.1 electrical* / x16 mech. connector
    • 1 – x4/x1 PCI Express 2.0/1.1 electrical# / x16 mech. connector
    • *Link speed SBC dependent
  • IOB3x on SBC – link width SBC dependent
  • Innovative 24-port/96-lane PCIe Gen 2 switch
  • IOB33 PCIe link expansion slot
  • Long life cycle with 7+ year backplane availability
     

The BPG7087 PCI Express backplane is designed and manufactured in Trenton’s ISO 9001:2008 registered facilities, supported from within the USA, and backed by a 5-year factory warranty.

Tech Specs

Model Number

BPG7087

Form Factor

14-slot form factor supports one combo or graphics-class, PICMG 1.3 SHB and up to ten PCI Express option cards.  All card slots use x16 PCIe mechanical connectors and four of these slots are driven with x16 PCIe 2.0 electrical interfaces.

Mechanical

Board dimensions: 12.3” x 12.9” with a minimum drive tower cut-out of 14.53 square inches
 

The nominal backplane thickness is 0.080”; however, the backplane mounting holes are recessed 0.018” on the bottom to provide an effective PCB thickness of 0.062” for use in the chassis design process.

Configuration

Graphics:  Four PCIe x16 and six PCIe x4 electrical interfaces, all card slots features x16 mechanical connectors
 

Note 1:  Optional IOB33 module required to provide a x4/x1 PCIe electrical link to backplane slot PCIe2.  The PCIe link width (x1 or x4) is determined by the specific system host board.
 

Note 2:  Backplane slots PCIe3 through PCIe10 may operate as PCIe 2.0 slots depending on the end point devices installed into these slots and regardless of the system host board x16 root link type.
 

Note 3:  Backplane slots PCIe1 and PCIe2 operate as PCIe 2.0 slots when both the SHB and end point device supports the Gen 2 interface.
 

Note 4:  Backplane slot PCIe2 requires either an optional IOB33 or IOB31 interface module on the SHB in order to make this card slot functional.
 

Note 5:  Video, graphics or GPU cards with a x16 PCI Express interface should be connected into backplane slots PCIe4, PCIe6, PCIe8 and/or PCIe10 to take full advantage of the x16 link speed.

Size

12.3″ x 12.9″
(14-slot)

Card Slots

4 – x16 PCI Express 2.0/1.1 electrical / x16 mech. connectors
4 – x4 PCI Express 2.0/1.1 electrical / x16 mech. connectors
1 – x4 PCI Express 2.0/1.1 electrical* / x16 mech. connector
1 – x4/x1 PCI Express 2.0/1.1 elect.# / x16 mech. connector
 

*Link speed SBC dependent
#From IOB3x on SBC / link width SBC dependent

Suggested SHB/SBCs

Trenton models – BXT7059, BXTS7059, JXT6966, JXTS6966, TSB7053, TQ9 and TML

SHB Configuration

Any combo or graphics-class PICMG 1.3 system host board including Trenton’s BXT7059, BXTS7059, JXT6966, JXTS6966, TSB7053, TQ9 or TML with optional IOB33 plug-in modules.

Agency Approvals & Compliance

Designed for UL60950 and CAN/CSA C22.2 No.60950-00, EN55022:1998 Class B, EN61000-4-2:1995, EN61000-4-3:1997, EN61000-4-4:1995, EN61000-4-5:1995, EN61000-4-6:1996, EN61000-4-11:1994

Power Connectors

ATX/EPS power source – one vertical 24-position ATX/EPS connector
 

+12V AUX power source – two vertical 8-position connectors
 

Extended power source – one 10-position terminal block to supply additional power if needed

Power Indicators

+5V, +5V AUX, +12V, and +3.3V power connection and status

Environmental

Operating Temp:  0°C to 60°C
 

Storage Temp: -40° to 70°C
 

Humidity: 5% to 90% non-condensing
 

Trenton’s BPG7087 is a lead free, RoHS compliant backplane.

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U.S. Design & Assembly

U.S. Design & Assembly

Years in Business

Years in Business

Year Warranty

Year Warranty

Year Product Life Cycle

Year Product Life Cycle

The Trenton Difference

Trenton Systems designs, manufactures and integrates rugged computers and long-life components such as single board computers and PCI Express backplanes to create application-ready computing solutions that satisfy our customers' unique requirements for functionality, performance and reliability.