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  • BPG8032 Backplane Features
  • BPG8032 Backplane Tech Specs
  • BPG8032 Backplane Download Documents

The BPG8032 PCI Express Backplane

Trenton’s BPG8032 PCI Express backplane features seventeen (17) x16 PCI Express electrical interface links that enable system designers to support multiple high-end video/graphics or GPU cards in a single rackmount computer system.  There are eighteen total slots to support standard PCI Express plug-in I/O cards.  A single-processor Trenton TSB7053 SBC or a dual-processor BXT7059 SBC has the PCIe links to drive the backplane integrated into the CPUs.
 

Trenton SBCs also support the PCI Express auto-training function to ensure SBC-to-option card communications regardless of PCIe interface type or link width.  This SBC and backplane design feature maximizes system flexibility by enabling system support for standard PCIe 3.0, 2.0 or 1.1 option cards having various PCIe electrical interface link widths such as x16, x8, x4 and x1.

Key Features

Key Features

Key features of the BPG8032 PCI Express backplane include:
 

  • A building block for scalable video wall controllers and GPU computing solutions
  • Features seventeen x16 PCI Express option card slots driven with x16 PCIe links
  • Supports up to nine NVIDIA® Tesla® 20-series GPUs for cluster computing
  • Supports up to fourteen Matrox® Mura™ MPX Series video wall controller boards
  • Eighteen total PCIe 2.0 option card slots available in PCI Express backplane applications
    • 17 – x16 PCI Express 2.0/1.1 electrical / x16 mech. connectors
    • 1 – x4 PCI Express 2.0/1.1 electrical / x16 mech. connectors
  • Innovative 24-port/96-lane PCIe Gen 2 switches reduce data latency
  • Long life cycle with 7+ year backplane availability
     

The BPG8032 PCI Express backplane is designed and manufactured in Trenton’s ISO 9001:2008 registered facilities, supported within the United States, and comes with a 5-year factory warranty.

Tech Specs

Model Number

BPG8032 or BPG8032M

Form Factor

20-slot form factor supports one combo or graphics-class, PICMG 1.3 SHB and up to eighteen PCI Express option cards.  All card slots use x16 PCIe mechanical connectors and seventeen of these slots are driven with x16 PCIe 2.0 electrical interfaces.

Mechanical

Board dimensions: 16.4” x 12.9”

The nominal backplane thickness is 0.080”; however, the backplane mounting holes are recessed 0.018” on the bottom to provide an effective PCB thickness of 0.062” for use in the chassis design process.

Configuration

Graphics: Seventeen PCIe x16 and one PCIe x4 (all x16 mechanical) slots
 

Note 1:  Backplane slots PCIe2 through PCIe18 feature x16 PCI Express electrical interfaces that may operate as PCIe 2.0 slots depending on the end point devices installed into these slots and regardless of the system host board’s x16 root link type.
 

Note 2:  Backplane slot PCIe1 is driven with a x4 PCI Express electrical interface direct from the SHB.  PCIe1 operates as a PCIe 2.0 slot when both the SHB and the end-point device support the Gen 2 interface.
 

Note 3:  Video, graphics or GPU cards with a x16 PCI Express electrical interface should be connected into backplane slots PCIe2 through PCIe18 to take full advantage of the x16 link speed.
 

Note 4:  The total stack-up height of the SHB’s cooling solution and/or the placement of the cooling solution on the SHB may cause an interference issue when trying to plug option cards into either BPG8032 backplane slot PCIe1 and/or PCIe2.  This potential interference may prevent the usage of one or both of these slots in some applications.

Size

16.4″ x 12.9″
(large format/20-slot)

Card Slots

17 – x16 PCI Express 2.0/1.1 electrical / x16 mech. connectors
1 –   x4 PCI Express 2.0/1.1 electrical / x16 mech. connector

Suggested SHB/SBCs

Trenton models – BXT7059, BXTS7059, JXT6966, JXTS6966, TSB7053, TQ9 and TML

SHB Configuration

Any combo or graphics-class PICMG 1.3 system host board including Trenton’s BXT7059, BXTS7059, JXT6966, JXTS6966, TSB7053, TQ9 or the upcoming THD8141 with a planned availability in Q3 of 2014..  An optional IOB33 or IOB31 plug-in module is not required for use with the BPG8032 backplane.

Agency Approvals & Compliance

Designed for UL60950 and CAN/CSA C22.2 No.60950-00, EN55022:1998 Class B, EN61000-4-2:1995, EN61000-4-3:1997, EN61000-4-4:1995, EN61000-4-5:1995, EN61000-4-6:1996, EN61000-4-11:1994

Power Connectors

ATX/EPS power source – one right-angle or vertical 24-position ATX/EPS connector
 

+12V AUX power source – five right-angle or vertical 8-position connectors

Power Indicators

+5V, +5V AUX, +12V, and +3.3V power connection and status

Environmental

Operating Temp:  0°C to 60°C
 

Storage Temp: -20° to 70°C
 

Humidity: 5% to 90% non-condensing
 

Trenton’s BPG8032 is a lead free, RoHS compliant backplane.

Need pricing for the BPG8032 backplane?

U.S. Design & Assembly

U.S. Design & Assembly

Years in Business

Years in Business

Year Warranty

Year Warranty

Year Product Life Cycle

Year Product Life Cycle

The Trenton Difference

Trenton Systems designs, manufactures and integrates rugged computers and long-life components such as single board computers and PCI Express backplanes to create application-ready computing solutions that satisfy our customers' unique requirements for functionality, performance and reliability.