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  • BPG8150 Backplane Features
  • BPG8150 Backplane Tech Specs
  • BPG8150 Backplane Download Documents

The BPG8150 PCI Express Small Form Factor Backplane

The BPG8150 PCIe small form factor backplane is also designed for future dual-processor PCIe Gen3 SHBs that will enable all seven slots to be driven by PCI Express Gen3 links.  Both the PCI Express Gen3 switches and the BXT7059 automatically establish communications with either PCI Express 3.0, 2.0 or 1.1 option cards.  This I/O card flexibility inherent in the BPG8150 PCIe small form factor backplane makes this product an ideal building block in military computing, industrial automation, medical diagnostics, telecommunications & GPU computing applications.
 

The backplane’s 16-port/64-lane and 5-port/48-lane PCIe Gen3 switches deliver PCIe 3.0 links to all option card slots except slot PCIe3, card slot PCIe3 is currently driven with a PCIe 2.0 link directly from the BXT7059 SHB.  Both the switches and the BXT7059 automatically establish communications with either PCI Express 3.0, 2.0 or 1.1 option cards, and all option card slots utilize x16 mechanical connectors.  Card slots PCIe1, PCIe2, PCIe6, and PCIe7 are driven with x16 electrical links making these four slots ideal for high-end video, graphics and GPU cards.  Card slots PCIe4 and PCIe5 are driven with x8 electrical links, while the PCIe3 slot is driven with a x4 PCI Express interface connection from the SHB’s B0 link.  The BPG8150 backplane has a right angle ATX/EPS and a 12V AUX power connector plus an optional terminal block is available to meet expanded system power demands.

Key Features

Key Features

PCIe links integrated into the current BXT7059 SBC; as well as future Trenton dual-processor SBC’s, automatically match an option card’s PCI Express link type and speed via the interface’s built-in auto-training capability.  This SBC and backplane design feature maximizes system flexibility by enabling system support for standard PCI Express 3.0, 2.0 or 1.1 option cards having various PCIe electrical interfaces such as x16, x8, x4 and x1 PCIe links.
 

Key features of the BPG8150 PCI Express small form factor backplane include:
 

  • Ideal PCI Express backplane for PCIe Gen3 x16 PCI Express video processing, graphics and GPU computing
  • Features multiple x16, x8 and x4 PCI Express 3.0 option card slots
  • Seven total PCIe option card slots available in PCI Express backplane applications
    • 4 – x16 PCI Express 3.0/2.0/1.1 electrical / x16 mech. connectors
    • 2 –   x8 PCI Express 3.0/2.0/1.1 electrical / x16 mech. connectors
    • 1 –   x4 PCI Express 2.0/1.1 electrical / x16 mech. connector
  • State-of-the-art PCI Express 3.0 switches ensure fast and reliable option card-to-SBC data communications
  • Backplane routing and PCIe Gen3 switch design minimizes data latency while maximizing data throughput and bandwidth
  • Long life cycle with 7+ year backplane availability

Tech Specs

Model Number

BPG8150

Form Factor

Small form factor [7.9″/200mm (W) x 12.9″/327mm (D)] supports one, dual-processor PICMG 1.3 single board computer equipped with a PEX10 option card and up to seven PCI Express option cards.  All card slots use x16 PCIe mechanical connectors.  The backplane’s two PCIe Gen3 switches deliver PCI Express 3.0 electrical interfaces to six of the backplane’s seven slots.

Mechanical

Board dimensions: 7.9” x 12.9” (200.6mm x 327.6mm) small form factor backplane
 

The nominal backplane thickness is 0.080”; however, the backplane mounting holes are recessed 0.018” on the bottom to provide an effective PCB thickness of 0.062” for use in the chassis design process.

Configuration

The seven available PCI Express option card slots on the BPG8150 backplane are configured as follows:
 

4 – x16 PCI Express 3.0/2.0/1.1 electrical / x16 mechanical connectors
 

2 –   x8 PCI Express 3.0/2.0/1.1 electrical / x16 mechanical connectors
 

1 –   x4 PCI Express 2.0/1.1 electrical / x16 mechanical connector (Note: This slot is driven by SBC link B0)
 

Note 1:  A dual-processor PICMG 1.3 SHB like the Trenton BXT7059 with the optional PEX10 PCIe link expansion module is required for PCIe1 and PCIe2 card slot functionality
 

Note 2:  If a single-processor PICMG 1.3 SHB like the Trenton TSB7053 is used with the BPG8150 backplane, then cards slots PCIe1 and PCIe2 will be unavailable.
 

Note 3:  If a dual-processor PICMG 1.3 SHB is used without the PEX10 link expansion module, then cards slots PCIe1 and PCIe2 will be unavailable.
 

Note 4:  PCI Express link training is fully supported on the BPG8150 backplane.  This allows any PCIe card to function in any backplane slot.  PCI Express 3.0 link speeds are possible in all backplane slots except PCIe3.  This limitation may change with future single board computer designs.

Size

7.9” x 12.9” (200.6mm x 327.6mm)
(PICMG 1.3 small form factor backplane)

Card Slots

PCIe1*, PCIe2*, PCIe6, and PCIe7 – x16 PCI Express 3.0/2.0/1.1 elect./x16 mech. slots
 

PCIe4, and PCIe5 – x8 PCI Express 3.0/2.0/1.1 elec./x16 mech. slots
 

PCIe3 – x4 PCI Express 2.0/1.1 elect./x16 mech. slot
(Note: The PCIe3 card slot is driven by SBC link B0)
 

*PCIe1 and PCIe2 slot functionality requires a dual-processor SHB equipped with an optional PEX10 link expansion module

Suggested SHB/SBCs

Trenton model – BXT7059 equipped with the optional PEX10 PCI Express link expansion module

SHB Configuration

A dual-processor PICMG 1.3 single board computer; such as the Trenton BXT7059; equipped the optional PEX10 PCIe link expansion module, ensures that all card slots are active and being driven with the maximum number of PCI Express 3.0 electrical interfaces possible.

Power Connectors

ATX/EPS power source – one right-angle 24-position ATX/EPS connector
 

+12V AUX power source – one right-angle 8-position connectors

Power Indicators

+5V, +5VAUX, +3.3V, +12V, and +1.8V power status LEDs

Environmental

Operating Temp:  0°C to 60°C
 

Storage Temp: -40° to 70°C
 

Humidity: 5% to 90% non-condensing
 

The Trenton BPG8150 is a lead free, RoHS compliant backplane.

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U.S. Design & Assembly

U.S. Design & Assembly

Years in Business

Years in Business

Year Warranty

Year Warranty

Year Product Life Cycle

Year Product Life Cycle

The Trenton Difference

Trenton Systems designs, manufactures and integrates rugged computers and long-life components such as single board computers and PCI Express backplanes to create application-ready computing solutions that satisfy our customers' unique requirements for functionality, performance and reliability.

L-3 Mission Integration is deeply honored and privileged to have worked alongside the extremely professional and talented personnel at Trenton on the Korea Lot P-3C Upgrade Program. Thank you for a job exceptionally well done!

- L3 Mission Integration
Greenville, TX

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