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  • BPG8155 Backplane Features
  • BPG8155 Backplane Tech Specs
  • BPG8155 Backplane Download Documents

The BPG8155 PCI Express Backplane

The PCIe 3.0 link design of the BPG8155 PCI Express backplane supports a x16 PCIe Gen3 link from Trenton’s BXT7059 system host board as well as future PCIe Gen3 SHBs.  The backplane’s two, 16-port/64-Lane Gen3 switches deliver PCIe 3.0 links to option card slots PCIe2 through PCIe12 while PCIe1 is driven with a PCIe 2.0 link from the SHB.  The switches and the BXT7059 automatically establish communications with either PCI Express 3.0, 2.0 or 1.1 option cards.  All option card slots utilize x16 mechanical connectors.  Card slots PCIe5 and PCIe9 are driven with x16 electrical links while card slots PCIe2, 6 and PCIe12 are driven with x8 electrical links.  Card slots PCIe3, 4, 7, 8, 10 and 11 are driven with x4 PCIe 3.0 links.  PCIe1 is a slot driven with a x4 interface from the SHB’s B0 link.  The BPG8155 backplane has a right angle ATX/EPS and two 12V AUX power connectors plus a terminal block to meet expanded system power demands.
 

PCIe links integrated into the CPUs on the BXT7059 SBC automatically match an option card’s PCI Express link type and speed via the interface’s built-in auto-training capability.  This SBC and backplane design feature maximizes system flexibility by enabling system support for standard PCI Express 3.0, 2.0 or 1.1 option cards having various PCIe electrical interfaces such as x16, x8, x4 and x1 PCIe links.

Key Features

Key Features

Key features of the BPG8155 PCI Express backplane include:
 

  • Ideal PCI Express backplane for PCIe Gen3 video processing and GPU computing
  • Features multiple x16, x8 and x4 PCI Express 3.0 option card slots
  • Twelve total PCIe option card slots available in PCI Express backplane applications
    • 2 – x16 PCI Express 3.0/2.0/1.1 electrical / x16 mech. connectors
    • 3 –   x8 PCI Express 3.0/2.0/1.1 electrical / x16 mech. connectors
    • 6 –   x4 PCI Express 3.0/2.0/1.1 electrical / x16 mech. connectors
    • 1 –   x4 PCI Express 2.0/1.1 electrical / x16 mech. connector
  • Two state-of-the-art 16-port/64-lane PCIe Gen3 switches ensure fast and reliable option card-to-SBC data communications
  • Backplane routing and PCIe Gen3 switch design minimizes data latency while maximizing data throughput and bandwidth
  • Long life cycle with 7+ year backplane availability
     

The BPG8155 PCI Express backplane is designed and manufactured in Trenton’s ISO 9001:2008 registered facilities and supported from within the USA.  This 14-slot, PCIe Gen3 backplane is supported by Trenton’s 5-year factory warranty.

Watch the BPG8155 Product Video

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Tech Specs

Model Number

BPG8155

Form Factor

14-slot form factor supports one PICMG 1.3 single board computer and up to twelve PCI Express option cards.  All card slots use x16 PCIe mechanical connectors.  The backplane’s two 16-port/64-lane Gen3 switches deliver PCI Express 3.0 electrical interfaces to eleven of the backplane’s twelve slots.

Mechanical

Board dimensions: 12.3” x 12.9” with a minimum drive tower cut-out of 14.53 square inches
 

The nominal backplane thickness is 0.080”; however, the backplane mounting holes are recessed 0.018” on the bottom to provide an effective PCB thickness of 0.062” for use in the chassis design process.

Configuration

The twelve available PCI Express option card slots on the BPG8155 backplane are configured as follows:
 

2 – x16 PCI Express 3.0/2.0/1.1 electrical / x16 mechanical connectors
 

3 –   x8 PCI Express 3.0/2.0/1.1 electrical / x16 mechanical connectors
 

6 –   x4 PCI Express 3.0/2.0/1.1 electrical / x16 mechanical connectors
 

1 –   x4 PCI Express 2.0/1.1 electrical / x16 mechanical connector (Note: This slot is driven by SBC link B0)
 

Note 1:  Optional PCIe link expansion via and IOB33 module is not supported on the BPG8155 backplane; however, an IOB33 may be used on the SHB strictly for added system I/O interface capability such as RS232 serial ports,  See the IOB33 page for more details on I/O expansion capability.
 

Note 2:  Optional PEX10 module is not supported on the BPG8155 backplane.
 

Note 3:  Backplane slot PCIe1 operates as PCIe 2.0/1.1 slot.
 

Note 4:  PCI Express link training is fully supported on the BPG8155 backplane.  This allows any PCIe card to function in any backplane slot.  PCI Express 3.0 link speeds are possible in all backplane slots except PCIe2.  This limitation may change with future single board computer designs.

Size

12.3″ x 12.9″
(14-slot)

Card Slots

PCIe5 and PCIe9 – x16 PCI Express 3.0/2.0/1.1 elect./x16 mech. slots
 

PCIe2, PCIe6 and PCIe12 – x8 PCI Express 3.0/2.0/1.1 elec./x16 mech. slots
 

PCIe3, PCIe4, PCIe7, PCIe8, PCIe10 and PCIe11 – x4 PCI Express 3.0/2.0/1.1 elect./
x16 mech. slots
 

PCIe1 – x4 PCI Express 2.0/1.1 elect./x16 mech. slot
(Note: The PCIe1 card slot is driven by SBC link B0)

Suggested SHB/SBCs

Trenton model – BXT7059

SHB Configuration

A PICMG 1.3 single board computer; such as the Trenton BXT7059, ensures that all card slots are active and being driven with the maximum number of PCI Express 3.0 electrical interfaces possible.

Power Connectors

ATX/EPS power source – one right-angle 24-position ATX/EPS connector
 

+12V AUX power source – two right-angle 8-position connectors
 

Extended power source – one 10-position terminal block to supply additional power if needed

Power Indicators

+5V, +5V AUX, +3.3V, +12V, +1.8V, and +0.9V power status LEDs

Environmental

Operating Temp:  0°C to 60°C
 

Storage Temp: -20° to 70°C
 

Humidity: 5% to 90% non-condensing
 

Trenton’s BPG8155 is a lead free, RoHS compliant backplane.

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U.S. Design & Assembly

U.S. Design & Assembly

Years in Business

Years in Business

Year Warranty

Year Warranty

Year Product Life Cycle

Year Product Life Cycle

The Trenton Difference

Trenton Systems designs, manufactures and integrates rugged computers and long-life components such as single board computers and PCI Express backplanes to create application-ready computing solutions that satisfy our customers' unique requirements for functionality, performance and reliability.

L-3 Mission Integration is deeply honored and privileged to have worked alongside the extremely professional and talented personnel at Trenton on the Korea Lot P-3C Upgrade Program. Thank you for a job exceptionally well done!

- L3 Mission Integration
Greenville, TX

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