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HDB8227 HDEC Series 2U Butterfly Backplane
An HDB8227 HDEC Series 2U butterfly backplane delivers more bandwidth with lower data latencies between an HDEC Series system host board to as many as four (4) industry standard PCI Express plug-in cards in a compact 2U rackmount computer system design. This unique 2U butterfly backplane design eliminates expensive PCI Express switches and makes full use of the eighty (80) native lanes of Gen3 PCI Express from the dual Intel® Xeon® E5-2600 v3 series processors on an HEP8225 HDEC Series system host board.Request a Quote
- HDB8227 Backplane Features
- HDB8227 Backplane Tech Specs
- HDB8227 Backplane Download Documents
The HDB8227 HDEC Series 2U Butterfly Backplane
Trenton’s HDB8227 HDEC Series 2U butterfly backplane also takes full-advantage of the high-density PCI Express I/O connectors on an HDEC Series system host board to support numerous system I/O connections. Routing the system host board’s device I/O; i.e. USB3.0, USB2.0, SATA/600, etc., down to the HDB8227 HDEC Series 2U butterfly backplane streamlines system cable routing, improves airflow, and enhances the MTTR advantages inherent in the HDEC Series architecture.
Trenton designs all of our HDEC Series system host boards and backplanes to fully support the PCI Express auto-training function that ensures SHB-to-option card communications regardless of PCI Express interface type or link width. This SHB and backplane design feature maximizes system flexibility by enabling system support for standard PCIe 3.0, 2.0 or 1.1 option cards having various PCIe electrical interface link widths such as x16, x8, x4 and x1.
Key features of the HDB8227 HDEC Series 2U butterfly backplane include:
- A building block for scalable military and industrial computers, industrial automation solutions and video wall controllers
- Four PCIe 3.0 option card slots available in a PCI Express backplane application
- 4* – x16 PCI Express 3.0 electrical / x16 mech. connectors
- *Some larger PCIe cards may prevent full utilization of all the backplane slots
- Numerous device I/O connections simplify system integration, and cable routing
- 6 – SATA/600 connectors
- 2 – USB3 interface header connections
- 4 – USB2 interface ports
- 4 – System fan headers with built-in fan speed control
- Plus much more!
- Butterfly format backplane supports standard 2U rackmount computer chassis
- Long life cycle with 7+ year backplane availability
This HDEC Series 2U butterfly format backplane supports one dual-processor HDEC Series SHB and up four x16 PCI Express option cards. All card slots are designed for the x16 PCIe Gen3 electrical interface. Three of the x16 cards slots are on backplane side B, while the remaining x16 PCIe slot is on side A along with the HDEC Series system host board slot.
Board dimensions: 14.6″/371mm x 3.3″/84mm
The nominal backplane thickness is 0.062”/1.57mm.
Four x16 PCI Express slots; with three on backplane side B and one on side A, are all PCIe Gen3 capable
Note 1: All backplane slots are driven with native PCIe 3.0 links direct from the two processors on a compatible, dual-processor HDEC Series system host board such as Trenton’s HEP8225.
Note 2: Each backplane slot is driven with a dedicated x16 PCIe Gen3 link from one of the SHB’s processors.
Note 3: All four backplane slots may not be available if all four plug-in cards are large double-wide PCIe plug-in cards such as the Telsa class of GPUs from NVIDIA.
14.6″/371mm x 3.3″/84mm
(2U butterfly format)
Backplane Side A: 1 – 16 PCI Express 3.0/2.0/1.1 electrical / x16 mech. connectors
Backplane Side B: 3 – 16 PCI Express 3.0/2.0/1.1 electrical / x16 mech. connectors
Note: The HDEC Series system host board slot is on backplane side A.
The table below lists the device I/O and system status connections are available on the backplane when using a Trenton HDEC Series system host board like the HEP8225.
|5 -SATA/600 system headers||2 – USB3 interface system header connections|
|1 – LED dimmer header||4 – USB3 rear chassis access interface ports (SHB)|
|1 – System keypad header||4 – System fan headers with fan speed control|
|1 – Clear CMOS header||2 – System temperature sensor headers|
|1 – 3.3V AUX power jumper for the card slots|
|4 – ACPI control headers (PSON, PWRBTN, RESET, PWRGD)|
|4 – Alarm status headers for the FAN, TEMP, VOLT and ERROR signals|
The following LED SHB and system status indicators are available on the HDB8227 backplane:
4 – System fan present LEDs
1 – System Host Board present LED
2 – Power regulator status LEDs for the 1V and 1.8V levels
4 – Incoming system power status LEDs for the 3.3V, 5V, 12V and 5V AUX supply levels
Trenton model – HEP8225
Any compatible HDEC Series, dual-processor system host board including Trenton’s HEP8225.
Agency Approvals & Compliance
Designed for UL60950 and CAN/CSA C22.2 No.60950-00, EN55022:1998 Class B, EN61000-4-2:1995, EN61000-4-3:1997, EN61000-4-4:1995, EN61000-4-5:1995, EN61000-4-6:1996, EN61000-4-11:1994
ATX/EPS power source – one vertical 24-position ATX/EPS connector
+12V AUX power source – one vertical 8-position connectors
+5V, +5V AUX, +12V, and +3.3V system power connection and status
+1V, and +1.8V power regulator level and status
Operating Temp: 0°C to 50°C with standard cooling solution and 350LFM of continuous airflow
Airflow: 350LFM continuous airflow
Storage Temp: -40° to 70°C
Humidity: 5% to 90% non-condensing
Trenton’s HDB8227 is a lead free, RoHS compliant backplane.