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  • HDB8228 Backplane Features
  • HDB8228 Backplane Tech Specs
  • HDB8228 Backplane Download Documents

The HDB8228 HDEC Series Midsize Backplane

Routing PCIe links directly to a backplane’s option card slots eliminates PCIe switch hops between the SHB and any of the system plug-in cards.  Eliminating switch hops can provide a 15.3% average bandwidth gain per option card slot compared to previous generation PICMG 1.3 backplane designs.  Compared to the 32GB/s aggregate slot bandwidth of a similar previous generation backplane design, the switchless design of the HDB8228 HDEC Series midsize backplane delivers a 5x bandwidth increase for an amazing 160GB/s of aggregate slot bandwidth!
 

Trenton’s HDB8228 HDEC Series midsize backplane also takes full-advantage of the high-density PCI Express I/O connectors on an HDEC Series system host board to support numerous system I/O connections.  Routing the system host board’s device I/O; i.e. USB3.0, USB2.0, SATA/600, etc., down to the HDB8228 HDEC Series midsize backplane streamlines system cable routing, improves airflow, and enhances the MTTR advantages inherent in the HDEC Series architecture.

Key Features

Key Features

Key features of the HDB8228 HDEC Series midsize backplane include:
 

  • A building block for scalable military and industrial computers, industrial automation and big data computing solutions
  • Eight total PCIe 3.0 option card slots available in PCI Express backplane application
    • 4 – x16 PCI Express 3.0 electrical / x16 mech. connectors
    • 4 –  x4 PCI Express 3.0/ electrical / x16 mech. connectors*
  • Numerous device I/O connections simplify system integration, and cable routing
    • 6 – SATA/600 connectors
    • 2 – USB3 interface header connections
    • 4 – USB2 interface ports
    • 1 – Serial port
    • 1 – PS/2 mouse header
    • 1 – PS/2 keyboard header
    • 8 – GPIO Signals
    • 4 – System fan headers with built-in fan speed control
    • Plus much more!
  • Ideal midsize form factor support standard 4U rackmount computer chassis
  • Long life cycle with 7+ year backplane availability
     

Trenton designs all of our HDEC Series system host boards and backplanes to fully support the PCI Express auto-training function that ensures SHB-to-option card communications regardless of PCI Express interface type or link width.  This SHB and backplane design feature maximizes system flexibility by enabling system support for standard PCIe 3.0, 2.0 or 1.1 option cards having various PCIe electrical interface link widths such as x16, x8, x4 and x1.

Tech Specs

Model Number

HDB8228

Form Factor

HDEC Series midsize format backplane supports one dual-processor HDEC Series SHB and up eight PCI Express option cards.  All card slots are designed for the Gen3 PCIe electrical interface and are equipped with x16 PCIe mechanical connectors.  Four of the card slots are driven with Gen3 PCI Express x16 electrical interfaces and the remaining four slots support a x4 PCIe electrical interface.

Mechanical

Board dimensions: 12.3″/312mm x 12.9″/328mm


The nominal backplane thickness is 0.080”; however, the backplane mounting holes are recessed 0.018” on the bottom to provide an effective PCB thickness of 0.062” for use in the chassis design process.

Configuration

Four x16 PCI Express and four x4 PCIe (all x16 mechanical) slots, and all card slots are PCIe Gen3 capable
 

Note 1:  All backplane slots are driven with native PCIe 3.0 links direct from the two processors on a compatible, dual-processor HDEC Series system host board such as Trenton’s HEP8225.
 

Note 2:  Backplane slots PCIe2, PCIe4, PCIe6 and PCIe8 are each driven with a dedicated x16 PCIe Gen3 link from one of the SHB’s processors.
 

Note 3:  Backplane slots PCIe1, PCIe3, PCIe5 and PCIe7 are each driven with a dedicated x4 PCIe Gen3 link from one of the SHB’s processors.
 

Note 4: The x16 PCIe interface card slots are placed in alternate backplane slot locations in order to accommodate double-wide PCIe plug-in cards such as the Telsa class of GPUs from NVIDIA.

Size

12.3″/312mm x 12.9″/328mm
(midsize format)

Card Slots

4 – x16 PCI Express 3.0/2.0/1.1 electrical / x16 mech. connectors (card slots PCIe2, 4, 6, and 8)
4 –   x4 PCI Express 3.0/2.0/1.1 electrical / x16 mech. connector (card slots PCIe1, 3, 5, and 7)

Connectors

The table below lists the device I/O and system status connections are available on the backplane when using a Trenton HDEC Series system host board like the HEP8225.

6 – SATA/600 system headers 2 – USB3 interface system header connections
1 – Serial port header 4 – USB2 rear chassis access interface ports
1 – PS/2 mouse header 8 – GPIO signals available via a GPIO system header
1 – PS/2 keyboard header 1 – JTAG system header
1 – JTAG header 4 – System fan headers with built-in fan speed control
1 – LED dimmer header 2 – System temperature sensor header connections
1 – System speaker header 4 – ACPI control headers
(PSON, PWRBTN, RESET, PWRGD)
1 – System keypad header 1 – SMBus header
1 – Clear CMOS header 1 – 3.3V AUX power jumper for the card slots
4 – Alarm status headers for the FAN, TEMP, VOLT and ERROR signals

Indicators

The following LED SHB and system status indicators are available on the HDB8228 backplane:
 

2 – Seven segment LEDs for SHB POST code status
8 – System fan present LEDs
1 – System Host Board present LED
2 – Power regulator status LEDs for the 1V and 1.8V levels
4 – Incoming system power status LEDs for the 3.3V, 5V, 12V and 5V AUX supply levels

Suggested SHBs

Trenton model – HEP8225

SHB Configuration

Any compatible HDEC Series, dual-processor system host board including Trenton’s HEP8225.

Agency Approvals & Compliance

Designed for UL60950 and CAN/CSA C22.2 No.60950-00, EN55022:1998 Class B, EN61000-4-2:1995, EN61000-4-3:1997, EN61000-4-4:1995, EN61000-4-5:1995, EN61000-4-6:1996, EN61000-4-11:1994

Power Connectors

ATX/EPS power source – one right-angle or vertical 24-position ATX/EPS connector
 

+12V AUX power source – two right-angle or vertical 8-position connectors
 

Terminal block – one four-position terminal block for extended current applications

Power Indicators

+5V, +5V AUX, +12V, and +3.3V system power connection and status
 

+1V, and +1.8V power regulator level and status

Operating Temperature

Operating Temp:  0°C to 50°C with standard cooling solution and 350LFM of continuous airflow

Environmental

Airflow: 350LFM continuous airflow
 

Storage Temp: -40° to 70°C
 

Humidity: 5% to 90% non-condensing
 

Trenton’s HDB8228 is a lead free, RoHS compliant backplane.

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U.S. Design & Assembly

U.S. Design & Assembly

Years in Business

Years in Business

Year Warranty

Year Warranty

Year Product Life Cycle

Year Product Life Cycle

The Trenton Difference

Trenton Systems designs, manufactures and integrates rugged computers and long-life components such as single board computers and PCI Express backplanes to create application-ready computing solutions that satisfy our customers' unique requirements for functionality, performance and reliability.