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  • HDB8236 Backplane Features
  • HDB8236 Backplane Tech Specs
  • HDB8236 Backplane Download Documents

The HDB8236 HDEC Series Small Form Factor Backplane

Four of the PCIe card slots on the HDB8236 HDEC Series small form factor backplane are driven with native x16 PCIe links from the dual Intel® Xeon® E5-2680 v3  processors available on an HEP8225 HDEC Series system host board.  The remaining PCIe slot is a x16 mechanincal slot driven with a native x8 PCIe link.  The SHB’s two Intel® Xeon® E5-2680 v3 provide a combined 24-cores of processing capacity.   The combination of backplane features and system integration capabilities enables innovative two-in-one computing designs for today’s demanding embedded computing, and data security applications in military computing, industrial automation, and medical diagnostics applications.


Trenton designs all of our HDEC Series system host boards and backplanes to fully support the PCI Express auto-training function that ensures SHB-to-option card communications regardless of PCI Express interface type or link width.  This SHB and backplane design feature maximizes system flexibility by enabling system support for standard PCIe 3.0, 2.0 or 1.1 option cards having various PCIe electrical interface link widths such as x16, x8, x4 and x1.

Key Features

Key Features

Key features of the HDB8236 HDEC Series small form factor backplane include:
 

  • A building block for small form factor “shoebox” computer enclosures or two-in-one military, industrial automation and medical diagnostics systems
  • Five total PCIe Express 3.0 option card slots available:
    • 4 – x16 PCI Express 3.0 electrical / x16 mech. connectors
    • 1 – x8 PCI Express 3.0 electrical / x16 mech. connector
  • One HDEC Series system host board slot
  • Numerous device I/O connections within each backplane segment simplifies system integration, and cable routing
    • 4 – SATA/600 connectors
    • 2 – USB3 interface header connections
    • 1 – Serial port
    • 1 – PS/2 mouse header
    • 1 – PS/2 keyboard header
    • 8 – GPIO Signals
    • 4 – System fan headers with built-in fan speed control
    • Plus much more!
  • Ideal small form factor backplane for supporting two-in-one system designs using standard 5U rackmount computer chassis
  • Makes a good backplane building block for small, “shoebox” computer system integration applications
  • Long life cycle with 7+ year backplane availability

Tech Specs

Model Number

HDB8236

Form Factor

HDEC Series small form factor backplane supports one dual-processor HDEC Series SHB and up five PCI Express option cards.  All card slots are designed for the Gen3 PCIe electrical interface and are equipped with x16 PCIe mechanical connectors.  Four of the card slots are driven with Gen3 PCI Express x16 electrical interfaces and the remaining slot supports a x8 PCIe electrical interface.
 

The size of the backplane makes it ideal for integrating into two-in-one, 5U rackmount computers or small “shoebox” chassis enclosures.

Mechanical

Board dimensions: 7.9″/201mm x 12.9″/328mm


The nominal backplane thickness is 0.080”; however, the backplane mounting holes are recessed 0.018” on the bottom to provide an effective PCB thickness of 0.062” for use in the chassis design process.

Configuration

Four x16 PCI Express and one x8 PCIe (all x16 mechanical) slots, and all card slots are PCIe Gen3 capable
 

Note 1:  All backplane slots are driven with native PCIe 3.0 links direct from the two processors on a compatible, dual-processor HDEC Series system host board such as Trenton’s HEP8225.
 

Note 2:  Backplane slots PCIe1, PCIe2, PCIe3 and PCIe5 are each driven with a dedicated x16 PCIe Gen3 link from one of the SHB’s processors.
 

Note 3:  Backplane slot PCIe4 is driven with a dedicated x8 PCIe Gen3 link from one of the SHB’s processors.
 

Note 4: The PCIe1, PCIe3, and PCIe5 x16 PCIe interface card slots are optimum slot locations for accommodating double-wide PCIe plug-in cards such as the Telsa class of GPUs from NVIDIA.

Size

7.9″/201mm x 12.9″/328mm
(small form factor “shoebox” format)

Card Slots

4 – x16 PCI Express 3.0/2.0/1.1 electrical / x16 mech. connectors (card slots PCIe1, 2, 3, and 5)
1 –   x8 PCI Express 3.0/2.0/1.1 electrical / x16 mech. connector (card slots PCIe4)

Connectors

The table below lists the device I/O and system status connections are available on the backplane when using a Trenton HDEC Series system host board like the HEP8225.

4 – SATA/600 system headers 2 – USB3 interface system header connections
1 – Serial port header 4 – USB3 rear chassis access interface ports (SHB)
1 – PS/2 mouse header 8 – GPIO signals available via a GPIO system header
1 – PS/2 keyboard header 1 – JTAG system header
4 – System fan headers with built-in fan speed control
1 – LED dimmer header 2 – System temperature sensor header connections
1 – System speaker header 4 – ACPI control headers
(PSON, PWRBTN, RESET, PWRGD)
1 – System keypad header 1 – Intruder alert header
1 – Clear CMOS header 1 – 3.3V AUX power jumper for the card slots
4 – Alarm status headers for the FAN, TEMP, VOLT and ERROR signals

Indicators

The following LED SHB and system status indicators are available on the HDB8228 backplane:
 

2 – Eight segment LEDs for SHB POST code status
4 – System fan present LEDs
1 – System Host Board present LED
2 – Power regulator status LEDs for the 1V and 1.8V levels
4 – Incoming system power status LEDs for the 3.3V, 5V, 12V and 5V AUX supply levels

Suggested SHBs

Trenton model – HEP8225

SHB Configuration

Any compatible HDEC Series, dual-processor system host board including Trenton’s HEP8225.

Agency Approvals & Compliance

Designed for UL60950 and CAN/CSA C22.2 No.60950-00, EN55022:1998 Class B, EN61000-4-2:1995, EN61000-4-3:1997, EN61000-4-4:1995, EN61000-4-5:1995, EN61000-4-6:1996, EN61000-4-11:1994

Power Connectors

ATX/EPS power source – one right-angle or vertical 24-position ATX/EPS connector
 

+12V AUX power source – two right-angle or vertical 8-position connectors
 

Terminal block – one four-position terminal block for extended current applications

Power Indicators

+5V, +5V AUX, +12V, and +3.3V system power connection and status
 

+1V, and +1.8V power regulator level and status

Operating Temperature

Operating Temp:  0°C to 50°C with standard cooling solution and 350LFM of continuous airflow

Environmental

Airflow: 350LFM continuous airflow
 

Storage Temp: -40° to 70°C
 

Humidity: 5% to 90% non-condensing
 

Trenton’s HDB8236 is a lead free, RoHS compliant backplane.

Need pricing for the HDB8236 backplane?

U.S. Design & Assembly

U.S. Design & Assembly

Years in Business

Years in Business

Year Warranty

Year Warranty

Year Product Life Cycle

Year Product Life Cycle

The Trenton Difference

Trenton Systems designs, manufactures and integrates rugged computers and long-life components such as single board computers and PCI Express backplanes to create application-ready computing solutions that satisfy our customers' unique requirements for functionality, performance and reliability.