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  • HDB8237 Backplane Features
  • HDB8237 Backplane Tech Specs
  • HDB8237 Backplane Download Documents

The HDB8237 HDEC Series Four Segment Backplane

In addition to the native x16 PCIe link for each HDB8237 backplane segment’s option card slot, the dual Intel® Xeon® E5-2680 v3 processors available on an HEP8225 HDEC Series system host board provides a combined 24-cores of processing capacity.  The combination of backplane segment features and system  integration capabilities enables innovative cluster computing designs for today’s demanding embedded computing, and data security applications in military computingindustrial automation, and medical diagnostics applications.

Key Features

Key Features

Key features of the HDB8237 HDEC Series four segment backplane include:
 

  • A building block for four-in-one military computers, industrial automation and medical diagnostics solutions
  • Four total PCIe 3.0 option card slots available:
    • 1 – x16 PCI Express 3.0 electrical / x16 mech. connectors in each segment
  • Four total HDEC Series system host board slots available:
    • 1 – HDEC Series system host board slot in each segment
  • Numerous device I/O connections within each backplane segment simplifies system integration, and cable routing
    • 4 – SATA/600 connectors
    • 2 – USB3 interface header connections
    • 4 – Rear chassis USB3 interface ports
    • 1 – Rear chassis Serial port
    • 4 – System fan headers with built-in fan speed monitoring
  • Ideal large format backplane for supporting standard 5U rackmount computer chassis
  • Long life cycle with 7+ year backplane availability
     

Trenton designs all of our HDEC Series system host boards and backplanes to fully support the PCI Express auto-training function that ensures SHB-to-option card communications regardless of PCI Express interface type or link width.  This SHB and backplane design feature maximizes system flexibility by enabling system support for standard PCIe 3.0, 2.0 or 1.1 option cards having various PCIe electrical interface link widths such as x16, x8, x4 and x1.

Tech Specs

Model Number

HDB8237

Form Factor

HDEC Series large format backplane has four independent computing segments.  Each backplane segment supports a dual-processor HDEC Series SHB and a x16 PCI Express option card.  A cluster computing system built with the HDB8237 can support up to four independent SHB and PCI Express cards.  All card slots are designed for the Gen3 PCIe electrical interface and are equipped with x16 PCIe mechanical connectors.

Mechanical

Board dimensions: 16.4″/417mm x 12.9″/328mm


The nominal backplane thickness is 0.080”; however, the backplane mounting holes are recessed 0.018” on the bottom to provide an effective PCB thickness of 0.062” for use in the chassis design process.

Configuration

Four segment backplane with one x16 PCI Express card slot, and one HDEC Series system host board slot in each backplane segment
 

Each backplane segment’s PCIe slot is driven with a native PCIe 3.0 link direct from the processors on a compatible HDEC Series system host board; such as Trenton’s HEP8225, plugged into the segment’s SHB slot.

Size

16.4″/417mm x 12.9″/328mm
(large format)

Card Slots

4 – x16 PCI Express 3.0/2.0/1.1 electrical / x16 mech. connectors (one per backplane segment)

Connectors

The table below lists the device I/O and system status connections available within each backplane segment when using a Trenton HDEC Series system host board like the HEP8225.

4 -SATA/600 system headers 2 – USB3 interface system header connections
1 – System fan header 4 – ACPI control headers
(PSON, PWRBTN, RESET, PWRGD)
1 – Clear CMOS header 1 – I2C header allows access to all four segments
1 – Alarm status headers for the FAN signals (backplane segment 2 location)

 

 

Indicators

The following LED SHB and system status indicators are available within each backplane segment:
 

1 – System fan present LED
1 – System Host Board present LED
4 – Incoming system power status LEDs for the 3.3V, 5V, 12V and 5V AUX supply levels

Suggested SHBs

Trenton model – HEP8225

SHB Configuration

Any compatible HDEC Series, dual-processor system host board including Trenton’s HEP8225.

Agency Approvals & Compliance

Designed for UL60950 and CAN/CSA C22.2 No.60950-00, EN55022:1998 Class B, EN61000-4-2:1995, EN61000-4-3:1997, EN61000-4-4:1995, EN61000-4-5:1995, EN61000-4-6:1996, EN61000-4-11:1994

Power Indicators

Each backplane segment contains the following system power supply connections:
 

ATX/EPS power source – one right-angle or vertical 24-position ATX/EPS connector
 

+12V AUX power source – one right-angle or vertical 8-position connectors

Indicators

The following LED power indicators are available within each backplane segment:
 

+5V, +5V AUX, +12V, and +3.3V system power connection and status

Operating Temperature

Operating Temp:  0°C to 50°C with standard cooling solution and 350LFM of continuous airflow

Environmental

Airflow: 350LFM continuous airflow
 

Storage Temp: -40° to 70°C
 

Humidity: 5% to 90% non-condensing
 

Trenton’s HDB8237 is a lead free, RoHS compliant backplane.

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U.S. Design & Assembly

U.S. Design & Assembly

Years in Business

Years in Business

Year Warranty

Year Warranty

Year Product Life Cycle

Year Product Life Cycle

The Trenton Difference

Trenton Systems designs, manufactures and integrates rugged computers and long-life components such as single board computers and PCI Express backplanes to create application-ready computing solutions that satisfy our customers' unique requirements for functionality, performance and reliability.