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  • HDB8259 Backplane Features
  • HDB8259 Backplane Tech Specs
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The HDB8259 HDEC Series Large Format Backplane

The HDB8259 HDEC Series Large Format Backplane

The HDB8259 HDEC Series Large Format Backplane provides full implementation of the 80 lanes of PCI Express 3.0 provided by the dual Intel® Xeon® E5-2600 v3 or v4 series processors available on a HEP8225 HDEC Series system host board combined with 24-cores of processing capacity.  The combination of backplane system integration capabilities and forward-thinking engineering enables innovative computing designs for today’s demanding embedded computing, big data and GPGPU Computing arenas. Key features of the HDB8259 HDEC Series Large Format Backplane include:
 

  • Fourteen total PCIe 3.0 option card slots available:
    • 4 – x16 PCI Express 3.0 electrical / x16 mech. connectors
    • 10 –  x8 PCI Express 3.0 electrical/ x16 mech. connectors
       
  • Numerous device I/O connections, simplifying system integration, and cable routing
    • 6 – SATA/600 connectors
    • 2 – USB3 interface header connections
    • 4 – Rear chassis USB2 interface ports
    • 8 – System fan headers with built-in fan speed monitoring
       
  • Ideal large format backplane for supporting standard 5U rackmount computer chassis

Tech Specs

Model Number

HDB8259

Form Factor

HDEC Series large format backplane supports one dual-processor HDEC Series SHB and up to fourteen PCI Express option cards.  All card slots are designed for the Gen3 PCIe electrical interface and are equipped with x16 PCIe mechanical connectors and I2C isolation.  Five of the HDB8259 backplane slots connected directly to the processors on the HEP8225 system host board.  Four of these slots feature PCI Express x16 PCIe electrical interfaces and the other direct-connect slot has a Gen3 PCIe x8 interface.  The backplane’s five remaining slots are driven by the SHB with a x8 electrical interface dynamically routed to each of the five slots via a 20-port PCIe Gen3 switch.

Mechanical

Board dimensions: 16.4″/416mm x 12.9″/328mm


The nominal backplane thickness is 0.080”; however, the backplane mounting holes are recessed 0.018” on the bottom to provide an effective PCB thickness of 0.062” for use in the chassis design process.

Size

16.4″/416mm x 12.9″/328mm

Configuration

Four x16 PCI Express, ten x8 (all x16 mechanical) slots, and all card slots are PCIe Gen3 capable.


Note 1:  The x16 and one x8 slot are driven with native PCIe 3.0 links direct from the two processors on a compatible, dual-processor HDEC Series system host board such as Trenton’s HEP8225.


Note 2:  Backplane slots PCIe2, PCIe4, PCIe6 and PCIe8 are each driven with a dedicated x16 PCIe Gen3 link from one of the SHB’s processors.


Note 3:  Backplane slot PCIe1 is driven with a dedicated x8 PCIe Gen3 link from one of the SHB’s processors.


Note 4: The x16 PCIe interface card slots are placed in alternate backplane slot locations in order to physically and thermally accommodate double-wide PCIe plug-in cards such as the Telsa class of GPUs from NVIDIA.


Note 5: The remaining PCIe x8 electrical slots are connected to the board’s processors via an 80-lane/20 port PCIe 3.0 switch.

Card Slots

4 – x16 PCI Express 3.0/2.0/1.1 electrical / x16 mech. connectors
10 – x8 PCI Express 3.0/2.0/1.1 electrical / x16 mech. connectors

Indicators

The following LED SHB and system status indicators are available on the HDB8229 backplane:
 

2 – Seven segment LEDs for SHB POST code status
8 – System fan present LEDs
1 – System Host Board present LED
2– Power regulator status LEDs for the .9V and 1.8V levels
4 – Incoming system power status LEDs for the 3.3V, 5V, 12V and 5V AUX supply levels
1 – EEPROM Program indicator LED
2 – PCIe switch fail indicator LED

Connectors

6 – SATA/600 system headers 2 – USB3 interface system header connections
1 – LED dimmer header 4 – USB2 rear chassis access interface ports
1 – System speaker header 8 – GPIO signals available via a GPIO system header
1 – System keypad header 4 – 3.3V AUX power jumpers for card slots
1 – Clear CMOS header 8 – System fan headers with built-in fan speed control
  4 – Alarm status headers for the FAN, TEMP, VOLT and ERROR signals

Suggested SHB/SBCs

Trenton Model: HEP8225

SHB Configuration

Any compatible HDEC Series, dual-processor system host board including Trenton’s HEP8225.

Agency Approvals & Compliance

Designed for UL60950 and CAN/CSA C22.2 No.60950-00, EN55022:1998 Class B, EN61000-4-2:1995, EN61000-4-3:1997, EN61000-4-4:1995, EN61000-4-5:1995, EN61000-4-6:1996, EN61000-4-11:1994

Power Connectors

ATX/EPS power source – one right-angle or vertical 24-position ATX/EPS connector
 

+12V AUX power source – four right-angle or vertical 8-position connectors
 

Terminal block – one four-position terminal block for extended current applications

Operating Temperature

Operating Temp:  0°C to 50°C with standard cooling solution and 350LFM of continuous airflow

Environmental

Airflow: 350LFM continuous airflow
 

Storage Temp: -40° to 70°C
 

Humidity: 5% to 90% non-condensing
 

Trenton’s HDB8229 is a lead free, RoHS compliant backplane.

Need pricing for the HDB8259 backplane?

U.S. Design & Assembly

U.S. Design & Assembly

Years in Business

Years in Business

Year Warranty

Year Warranty

Year Product Life Cycle

Year Product Life Cycle

The Trenton Difference

Trenton Systems designs, manufactures and integrates rugged computers and long-life components such as single board computers and PCI Express backplanes to create application-ready computing solutions that satisfy our customers' unique requirements for functionality, performance and reliability.

L-3 Mission Integration is deeply honored and privileged to have worked alongside the extremely professional and talented personnel at Trenton on the Korea Lot P-3C Upgrade Program. Thank you for a job exceptionally well done!

- L3 Mission Integration
Greenville, TX

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