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Tech Specs and Downloads.

Up-to-date technical specifications and related downloads of the BPG8150 Backplane

BPG8150 Backplane Downloads

  1. Data Sheet
  2. Layout Drawing, Connectors, Jumpers and LEDs

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Tech Specs

Model Number
Form Factor
Small form factor [7.9″/200mm (W) x 12.9″/327mm (D)] supports one, dual-processor PICMG 1.3 single board computer equipped with a PEX10 option card and up to seven PCI Express option cards.  All card slots use x16 PCIe mechanical connectors.  The backplane’s two PCIe Gen3 switches deliver PCI Express 3.0 electrical interfaces to six of the backplane’s seven slots.

Board dimensions: 7.9” x 12.9” (200.6mm x 327.6mm) small form factor backplane

The nominal backplane thickness is 0.080”; however, the backplane mounting holes are recessed 0.018” on the bottom to provide an effective PCB thickness of 0.062” for use in the chassis design process.

7.9” x 12.9” (200.6mm x 327.6mm)
(PICMG 1.3 small form factor backplane)

The seven available PCI Express option card slots on the BPG8150 backplane are configured as follows:

4 – x16 PCI Express 3.0/2.0/1.1 electrical / x16 mechanical connectors

2 –   x8 PCI Express 3.0/2.0/1.1 electrical / x16 mechanical connectors

1 –   x4 PCI Express 2.0/1.1 electrical / x16 mechanical connector (Note: This slot is driven by SBC link B0)

Note 1:  A dual-processor PICMG 1.3 SHB like the Trenton BXT7059 with the optional PEX10 PCIe link expansion module is required for PCIe1 and PCIe2 card slot functionality

Note 2:  If a single-processor PICMG 1.3 SHB like the Trenton TSB7053 is used with the BPG8150 backplane, then cards slots PCIe1 and PCIe2 will be unavailable.

Note 3:  If a dual-processor PICMG 1.3 SHB is used without the PEX10 link expansion module, then cards slots PCIe1 and PCIe2 will be unavailable.

Note 4:  PCI Express link training is fully supported on the BPG8150 backplane.  This allows any PCIe card to function in any backplane slot.  PCI Express 3.0 link speeds are possible in all backplane slots except PCIe3.  This limitation may change with future single board computer designs.

Card Slots

PCIe1*, PCIe2*, PCIe6, and PCIe7 – x16 PCI Express 3.0/2.0/1.1 elect./x16 mech. slots

PCIe4, and PCIe5 – x8 PCI Express 3.0/2.0/1.1 elec./x16 mech. slots

PCIe3 – x4 PCI Express 2.0/1.1 elect./x16 mech. slot
(Note: The PCIe3 card slot is driven by SBC link B0)

*PCIe1 and PCIe2 slot functionality requires a dual-processor SHB equipped with an optional PEX10 link expansion module

Suggested SHB/SBCs
Trenton model – BXT7059 equipped with the optional PEX10 PCI Express link expansion module
SHB Configuration
A dual-processor PICMG 1.3 single board computer; such as the Trenton BXT7059; equipped the optional PEX10 PCIe link expansion module, ensures that all card slots are active and being driven with the maximum number of PCI Express 3.0 electrical interfaces possible.
Power Connectors

ATX/EPS power source – one right-angle 24-position ATX/EPS connector

+12V AUX power source – one right-angle 8-position connectors

Power Indicators
+5V, +5VAUX, +3.3V, +12V, and +1.8V power status LEDs

Operating Temp:  0°C to 60°C

Storage Temp: -40° to 70°C

Humidity: 5% to 90% non-condensing

The Trenton BPG8150 is a lead free, RoHS compliant backplane.