HEP8225 Single Board Computer Downloads
- CE Certificate of Compliance
- Before You Begin
- Hardware Manual
- BIOS Setup Manual
- Intel® 612 Platform Controller Hub (i.e. chipset) Drivers
- Intel® Network Adapters for the Intel® x540 Ethernet Controller and the Intel® i217 Ethernet PHY
- Video Driver for the ASPEED AST2400
- Intel® SATA RAID Drivers for the Intel® 612 PCH
- USB 3.0 Drivers for Win7 and Win2008 Server
- All HEP8225 Driver Files
- Block Diagram
- HDEC Series I/O Diagram
- Layout Drawing
- Layout Drawing for Non-Audio Version
- Jumpers, Connectors, and Memory
- Application Note: HEP8225 Performance Benchmarks (Includes Broadwell-EP Update)
If you need to speak to a Support Engineer about your specifications using the HEP8225 Single Board Computer, please do not hesitate to contact us by phone at (770) 287-3100, via chat, or fill out a form below.
We will walk you through each requirement and recommend the best option that suits your application.
|HDEC Series® Form Factor – Supports industry standard PCI Express plug-in cards with expanded PCIe linking capabilities to increase system bandwidth and reduce data latencies. HDEC Series system host boards and backplanes are designed for easy system integration into industry standard 19″ rackmount computer enclosures.|
|2 – Intel Xeon E5-2600 v3 or v4 Series|
Long-Life Intel® Xeon® E5-2600 v4 series processor options (Broadwell-EP)
Long-Life Intel® Xeon® E5-2600 v3 series processor options (Haswell-EP)
These long-life processors support forty (40) native PCI Express 3.0 links per processor for a total of eighty (80) PCIe Gen3 links routed off the HEP8225 and down to an HDEC Series system backplane. Each processor supports a number of advanced Intel technologies including Intel® Hyper-Threading, Intel® Turbo Boost* and Intel® Virtualization (VT-x).
All the processor options listed here have five-to-seven years of product life cycle support from Intel making the system host board architecture ideal for high-density embedded computing system designs.
Additional long-life processor options are available, contact Trenton Systems for details.
*Note: The Intel® Xeon® E5-2608L v3 processor does not support Intel® Turbo Boost Technology.
|AMI - Aptio 5.x|
|Intel® C612 Platform Controller Hub (PCH)|
There are several HEP8225 system host board configurations available.Configuration Series A
Indicated by a 2 in product part number position 8 as seen here 92-822520700000, includes two (2) 10GbE and two (2) 1GbE LANs on the HEP8225’s I/O bracket, and two Intel® Xeon® E5-2680 v4 processors.
Configuration Series C
Indicated by a 6 in product part number position 8 as seen here 92-822560700000, includes two (2) 10GbE, two (2) 1GbE LANs, and no audio ports on the HEP8225’s I/O bracket, and two Intel® Xeon® E5-2680 v4 processors
Contact Trenton Systems for additional HEP8225 configuration information.
*Audio interface ports are not available when using the HEP8225 in a 2U rackmount computer chassis
The HEP8225’s four independent memory channels per processor are capable of supporting DDR4-2400 memory interface speeds. Maximum memory speed will vary as a function of the specific processors used on the HEP8225.
Registered DIMMs (RDIMMs) are required on the HEP8225.
|The HEP8225 provides a programmable watchdog timer with programmable timeout periods of 32 msec, 128 msec, 512 msec, 1 second, 4 seconds, 8 seconds or 32 seconds via board component U30. When enabled the WDT (i.e. U30) will generate a system reset. WDT control is supplied via the General Purpose IO pins from the Intel® C610 Platform Controller Hub (PCH).|
|Lithium – CMOS data retention|
The HEP8225 system host board; with an appropriate HDEC Series backplane (model number HDBxxx) are ideal long-life system building blocks for integrating into industry standard 2U, 4U and 5U rackmount computer enclosures. The HEP8225 board dimensions are as follows.
Board dimensions – 13.345” (33.896cm) L x 5.750” (14.605”cm) H
Standard cooling solution height – 2.975″ (75.57mm)
Low-profile cooling solution height – 1.438” (36.525mm)
|Agency Approvals & Compliance|
The HEP8225 HDEC Series is a CE compliant system host board; i.e. single board computer. Specifically, the HEP8225 is compliant to the 89/336/EEC-EMC Directive.
The standards to which CE conformity is declared are as follows:
|Mean Time Between Failures (MTBF)|
Note: POH = Power On Hours
|Power Requirements - 100% Stressed|
Typical Values* – 100% Stressed with 64GB of system memory
|Power Requirements - Idle|
Typical Values* – Static Desktop (System Idle) with 64GB of system memory
* These are typical power numbers; actual power numbers will vary as a function of the specific HEP8225 system configuration design.
Operating Temperature: 0-50° C with the standard cooling solution and 350LFM
Note: The maximum HEP8225 operating temperature; with 350LFM of air flow, is slightly less for processors that have a Thermal Design Power (TDP) rating of 120W. When using processor options such as the Intel Xeon E5-2680 v4 or v3, the HEP8225 maximum operating temperature is derated to 45° C.