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HEP8225 HDEC Series System Host Board
The HEP8225 HDEC Series system host board is the first in a series of new generation of single board computers that utilize the latest high-density PCI Express interconnect technology to deliver eighty (80) PCI Express 3.0 interfaces to an HDEC Series® backplane. This new PCI Express link expansion capability; along with additional system I/O capability, is provided by two, long-life Intel® Xeon® E5-2600 v3 or v4 series processors, and the board’s Intel® C612 platform controller hub.Request a Quote
- Tech Specs
The HEP8225 HDEC Series System Host Board
The HEP8225 HDEC Series system host board and related HDEC Series backplanes builds upon the basic goodness of the PICMG® 1.3 specification of faster system MTTRs, expanded support for industry standard PCI Express plug-in cards, and built-in system longevity, by increasing the base number of PCIe lanes between the HDEC Series SHB and backplane from 20 lanes to a maximum allowable limit of 88 lanes. This HDEC Series 68 lane PCIe expansion over the previous PICMG 1.3 specification of the potential SHB-to-backplane PCI Express interfaces results in an increase of 340%! Today’s Intel® Xeon® E5-2600 v4 processor options supported on the HEP8225 HDEC Series system host board delivers 80 lanes of PCI Express down to a backplane for a still impressive increase of 300% of over a PICMG 1.3 SHB. Future processors will enable the 88-lane PCIe link expansion capability defined in the HDEC Series base specification.
- Routes 80 native PCI Express 3.0 links from the SHB's processors to the system backplane
- More native PCIe links reduces switch latency and increases system bandwidth
- Supports the broadest array of standard and custom PCIe plug-in cards
- Efficient system interconnect cable management
- Robust SHB backer plate design is ideal for rugged computer designs
- Supports extended system deployments with a long-life, Made in USA hardware platform
- 5-year factory warranty and 7 to 10-year product availability
HDEC Series® Form Factor – Supports industry standard PCI Express plug-in cards with expanded PCIe linking capabilities to increase system bandwidth and reduce data latencies. HDEC Series system host boards and backplanes are designed for easy system integration into industry standard 19″ rackmount computer enclosures.
2 – Intel Xeon E5-2600 v3 or v4 Series
Long-Life Intel® Xeon® E5-2600 v4 series processor options (Broadwell-EP)
|Intel® Xeon® E5-2680 v4 Processor – 14 cores, 2.4GHz base frequency/3.2GHz max. turbo frequency, 35MB cache, 120W TDP, DDR4-2400 maximum memory support|
|Intel® Xeon® E5-2658 v4 Processor – 14 cores, 2.3GHz base frequency/3.0GHz max. turbo frequency, 35MB cache, 105W TDP, DDR4-2400maximum memory support|
|Intel® Xeon® E5-2648L v4 Processor – 14 cores, 1.8GHz base frequency/2.5GHz max. turbo frequency, 35MB cache, 75W TDP, DDR4-2400 maximum memory support|
|Intel® Xeon® E5-2628L v4 Processor – 12 cores, 1.9GHz base frequency/2.4GHz max. turbo frequency, 30MB cache, 75W TDP, DDR4-2133 maximum memory support|
|Intel® Xeon® E5-2618L v4 Processor – 10 cores, 2.2GHz base frequency/3.3GHz max. turbo frequency, 25MB cache, 75W TDP, DDR4-2133 maximum memory support|
|Intel® Xeon® E5-2608L v4 Processor – 8 cores, 1.6GHz base frequency, 20MB cache, 52W TDP, DDR4-1866 maximum memory support|
Long-Life Intel® Xeon® E5-2600 v3 series processor options (Haswell-EP)
|Intel® Xeon® E5-2680 v3 Processor – 12 cores, 2.5GHz base frequency/3.3GHz max. turbo frequency, 30MB cache, 120W TDP, DDR4-2133 maximum memory support|
|Intel® Xeon® E5-2658 v3 Processor – 12 cores, 2.2GHz base frequency/2.9GHz max. turbo frequency, 30MB cache, 105W TDP, DDR4-2133 maximum memory support|
|Intel® Xeon® E5-2648L v3 Processor – 12 cores, 1.8GHz base frequency/2.5GHz max. turbo frequency, 30MB cache, 75W TDP, DDR4-2133 maximum memory support|
|Intel® Xeon® E5-2628L v3 Processor – 10 cores, 2.0GHz base frequency/2.5GHz max. turbo frequency, 25MB cache, 75W TDP, DDR4-1866 maximum memory support|
|Intel® Xeon® E5-2618L v3 Processor – 8 cores, 2.3GHz base frequency/3.4GHz max. turbo frequency, 20MB cache, 75W TDP, DDR4-1866 maximum memory support|
|Intel® Xeon® E5-2608L v3 Processor – 6 cores, 2.0GHz base frequency, 15MB cache, 52W TDP, DDR4-1600 maximum memory support|
These long-life processors support forty (40) native PCI Express 3.0 links per processor for a total of eighty (80) PCIe Gen3 links routed off the HEP8225 and down to an HDEC Series system backplane. Each processor supports a number of advanced Intel technologies including Intel® Hyper-Threading, Intel® Turbo Boost* and Intel® Virtualization (VT-x).
All the processor options listed here have five-to-seven years of product life cycle support from Intel making the system host board architecture ideal for high-density embedded computing system designs.
Additional long-life processor options are available, contact Trenton Systems for details.
*Note: The Intel® Xeon® E5-2608L v3 processor does not support Intel® Turbo Boost Technology.
AMI – Aptio® 5.x
Intel® C612 Platform Controller Hub (PCH)
There are several HEP8225 system host board configurations available.
- Configuration Series A
- Indicated by a 2 in product part number position 8 as seen here 92-822520700000, includes two (2) 10GbE and two (2) 1GbE LANs on the HEP8225’s I/O bracket, and two Intel® Xeon® E5-2680 v4 processors.
- Configuration Series B
- Indicated by a 5 in product part number position 8 as seen here 92-822550700000, includes four (4) 1GbE LANs on the HEP8225’s I/O bracket, and two Intel® Xeon® E5-2680 v4 processors.
- Configuration Series C
- Indicated by a 6 in product part number position 8 as seen here 92-822560700000, includes two (2) 10GbE, two (2) 1GbE LANs, and no audio ports on the HEP8225’s I/O bracket, and two Intel® Xeon® E5-2680 v4 processors.
- Configuration Series D
- Indicated by a 8 in product part number position 8 as seen here 92-822580700000, includes four (4) 1GbE LANs, and no audio ports on the HEP8225’s I/O bracket, and two Intel® Xeon® E5-2680 v4 processors.
Contact Trenton Systems for additional HEP8225 configuration information.
- 4 – x16 and two x8 PCIe 3.0 links (Edge connectors C1, C2 and C3)
- 2 – 10/100/1000/10000Base-T (I/O Bracket, SHB configuration dependent)
- 2 – 10/100/1000Base-T (I/O Bracket, SHB configuration dependent)
- 1 – RS232 Serial (I/O Bracket)
- 8 – SATA/600 ports with RAID (two on-board headers and six backplane interfaces)
- 6 – USB 3.0 interfaces (four I/O bracket ports and two backplane interfaces)
- 4 – USB 2.0 interfaces (four backplane interfaces)
- 1 – VGA Analog Video (I/O bracket)
- 1 – Audio Out (I/O bracket)*
- 1 – Audio In (I/O bracket)
- 1 – Mic In (I/O bracket)
*Audio interface ports are not available when using the HEP8225 in a 2U rackmount computer chassis
The HEP8225’s four independent memory channels per processor are capable of supporting DDR4-2400 memory interface speeds. Maximum memory speed will vary as a function of the specific processors used on the HEP8225.
The board’s eight standard DIMM sockets can support a total system memory capacity of 512GB when using the very expensive and relatively rare 64GB DDR4 memory DIMMs, 256GB when using the moderately expensive 32GB DDR4 memory DIMMs, and 128GB for the more common, and less costly 16GB DIMMs.
The HEP8225 provides a programmable watchdog timer with programmable timeout periods of 32 msec, 128 msec, 512 msec, 1 second, 4 seconds, 8 seconds or 32 seconds via board component U30. When enabled the WDT (i.e. U30) will generate a system reset. WDT control is supplied via the General Purpose IO pins from the Intel® C610 Platform Controller Hub (PCH).
Lithium – CMOS data retention
The HEP8225 system host board; with an appropriate HDEC Series backplane (model number HDBxxx) are ideal long-life system building blocks for integrating into industry standard 2U, 4U and 5U rackmount computer enclosures. The HEP8225 board dimensions are as follows.
Board dimensions – 13.345” (33.896cm) L x 5.750” (14.605”cm) H
Standard cooling solution height – 2.975″ (75.57mm)
Low-profile cooling solution height – 1.438” (36.525mm)
Some system integration applications using chassis such as 2U rackmount computers require lower profile cooling solutions. A low profile heat sink option is available for the HEP8225 board that allows option card placements of 1.550″ (39.37mm) from the topside of the board. A low profile cooling solution usually results in a 25-30% reduction in a systems maximum operating temperature rating.
Agency Approvals & Compliance
The HEP8225 HDEC Series is a CE compliant system host board; i.e. single board computer. Specifically, the HEP8225 is compliant to the 89/336/EEC-EMC Directive.
The standards to which CE conformity is declared are as follows:
IEC 55022: 2008 Class A, IEC 61000-3-2:2014 , IEC 61000-3-3: 2013,
IEC 61000-4-2: 2008, IEC 61000-4-3: 2006 + A1: 2007 + A2: 2010,
IEC 61000-4-4: 2012, IEC 61000-4-5: 2014, IEC 61000-4-6: 2013, and
IEC 61000-4-8: 2009 & IEC 61000-4-11: 2004
Mean Time Between Failures (MTBF)
|Operating Hours||Operating Temp.||MTBF Test Protocol|
|439,320 POH||40° C||Bellcore|
|704,191 POH||25° C||Bellcore|
Note: POH = Power On Hours
Power Requirements - 100% Stressed
Typical Values* – 100% Stressed with 64GB of system memory
|CPU Base Speed||Intel® Model Number||+5V||+12V||+3.3V|
Power Requirements - Idle
Typical Values* – Static Desktop (System Idle) with 64GB of system memory
|CPU Base Speed||Intel® Model Number||+5V||+12V||+3.3V|
14-core CPUs- E5-2680 v4, E5-2658 v4, E5-2648L v4
12-core CPUs – E5-2680 v3, E5-2658 v3, and E5-2648L v3, E5-2628L v4
10-core CPU – E5-2628L v3, E5-2618L v4
8-core CPUs – E5-2640 v3, and E5-2618L v3
6-core CPUs – E5-2620 v3, E5-2609 v3, and E5-2608L v3
* These are typical power numbers; actual power numbers will vary as a function of the specific HEP8225 system configuration design.
Operating Temperature: 0-50° C with the standard cooling solution and 350LFM
Note: The maximum HEP8225 operating temperature; with 350LFM of air flow, is slightly less for processors that have a Thermal Design Power (TDP) rating of 120W. When using processor options such as the Intel Xeon E5-2680 v4 or v3, the HEP8225 maximum operating temperature is derated to 45° C.
- Airflow: 350LFM continuous airflow
- Storage: -40° to 70° C.
- Humidity: 5% to 90% non-condensing.