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The THD8141 Single Board Computer

The THD8141 Single Board Computer

The THD8141 single board computer design utilizes PCIe 3.0 link retimers to ensure maximum single integrity between the processors’ native PCIe Gen3 links on the SBC and an I/O plug-in card located in a backplane slot farthest from the PCI Express root complex.  The SBC’s external I/O card interfaces adapt to PCIe 3.0, PCIe 2.1/2.0 and PCIe 1.1 plug-in cards with either a x16, x8, x4 or x1 PCI Express edge connector.

The board’s two, dual-channel memory interfaces support four standard DDR3-1600 memory DIMMs with all available THD8141 long-life processor options.  The three Gigabit Ethernet LAN interfaces includes a backplane LAN interface.  The rear-mounted PCIe mini-connector supports industry standard PCI Express Mini-Cards for system configurations requiring added Wi-Fi capability, additional SSD data storage or expanded I/O support.

Key Features

Key Features

Key features of the THD8141 single board computer include:
 

  • Supports long-life, multi-core Intel® Core™ i3/i5/i7 or Intel® Xeon® 1200 v3 series processors
  • Two, dual-channel, DDR3-1600 memory interfaces supports four DDR3 memory DIMMs
  • PCIe Gen3 and Gen2 interfaces support industry standard x16, x8, x4 and x1 PCI Express 3.0, 2.0 or 1.1 cards
  • Supports remote network management and security via Intel® vPro™ when using Core i5, Core i7 and Xeon CPU options
  • Includes out-of-band client system security and KVM access and control via Intel® AMT 9.0
  • PCI Express mini-connector supports plug-in WiFi, SSD Storage and other PCI Mini Cards
  • On-board digital and analog video interfaces plus multiple I/O and COMM interfaces
  • Supports industry standard PICMG 1.3 PCI Express backplanes

 

Trenton’s THD8141 single board computer maximizes system ROI with long-life, embedded components which drive an extended SBC product availability of seven years or more.  All Trenton single board computers are designed with a standard BIOS version that is maintained under strict revision control.

Trenton also builds-in BIOS flexibility by offering various BIOS modifications that may be needed to meet unique system requirements and maintains strict revision control for custom BIOS variations.The THD8141 is designed, manufactured and supported by Trenton Systems at our U.S. facilities and is covered by our exclusive five-year factory warranty.

Tech Specs

Model Number

THD8141

Form Factor

PICMG® 1.3 Form Factor – Automatically adapts to graphics or server-class backplane PCIe link configurations – one x16 and one x4/four x1 or two x8 and one x4/four x1 PCIe links

CPU

  • 1 – Intel Xeon E3-1200 v3 Series -or
  • 1 – Intel Core i7-4790S -or-
  • 1 – Intel Core i5-4590S -or-
  • 1 – Intel Core i3-4330TE

Processors

Long-Life 22nm/Haswell processor options
Intel® Xeon® E3-1275 v3 Processor – Quad core, 3.5GHz with Hyper-Threading, 8MB cache, 84W TDP
Intel® Xeon® E3-1225 v3 Processor – Quad core, 3.2GHz without Hyper-Threading, 8MB cache, 84W TDP
Intel® Xeon® E3-1268L v3 Processor – Quad core, 2.3GHz with Hyper-Threading, 8MB cache, 45W TDP
 

Intel® Core™ i7-4790S Processor – Quad core, 3.2GHz with Hyper-Threading, 8MB cache, 65W TDP
Intel® Core™ i5-4590S Processor – Quad core, 3.0GHz without Hyper-Threading, 6MB cache, 65W TDP
Intel® Core™ i3-4330TE Processor – Dual core, 3.5GHz with Hyper-Threading, 4MB cache, 35W TDP
 

These long-life processors built on the Intel® 22nm Micro-architecture (i.e. Haswell) feature native PCI Express 3.0 links to the system backplane and utilize a 5GT/s DMI or DMI2 interface to the board’s Intel® C226 PCH.
 

The board’s two dual-channel DDR3-1600 memory interfaces support four standard DIMM sockets for a 32GB maximum system memory capability when using 8GB DDR3 DIMMs.
 

Intel® AMT 9.0 support is available in all THD8141 long-life, embedded processor options.
 

Note: The Intel® Core™ i7-4790S and Intel® Core™ i5-4590S processor options do not support ECC memory.

BIOS (Flash)

AMI – Aptio® 4.x

Chipset

Intel® C226 Platform Controller Hub (PCH) (Lynx Point)

Configuration

DDR3-1600, 32GB max.

COMMS

  • 1 – x16 and one x4 or two x8 PCIe 3.0 links and one x4 PCIe 2.0 link (Edge connectors A&B)
  • 2 – 10/100/1000Base-T (I/O Bracket)
  • 1 – 10/100/1000 (Edge conn. C)

I/O

  • 6 – SATA/600 ports with RAID
  • 10 – USB interfaces (4 – USB3 and 6 – USB2)
  • 1 – PS/2 Mouse & 1 – PS/2 Kbd. header
  • 1 – PCIe Mini-Card
  • 1 – DVI-D Video
  • 1 – VGA Analog Video
  • 1 – IOB33 (Note: The IOB33 floppy port is not functional with the THD8141 SBC)

Memory

32GB maximum when using standard 8GB DDR3 DIMMs. The board’s two, dual-channel DDR3-1600 memory interfaces have four DIMM sockets that support unbuffered ECC, PC3-12800 DDR3 memory DIMMs.
 

All available THD8141 processor options support the DDR3-1600 maximum memory interface speed.
 

Note: The Intel® Core™ i7-4790S and Intel® Core™ i5-4590S processor options do not support ECC memory.  ECC memory DIMMs are cost effective and can be used with these processor options, but the processors will ignore the ECC functionality of the memory DIMMs

PCI Express Edge Card Interfaces

Standard PICMG 1.3 PCI Express Interfaces – Automatically adapts to graphics or server-class backplane PCIe link configurations – one x16, or two x8, or one x8 and two x4 PCIe 3.0 links from the SHB’s processor and one x4 PCIe 2.0 link for the board’s Intel C226 PCH.  The direct PCIe 3.0 links from the board’s processor (links A0, A1 and A2 ) may operate as either PCIe Gen3, Gen2 or Gen1.1 interfaces depending on the backplane design.  The x4 link from the board’s C226 PCH (link B0) also supports PCIe 2.0 or 1.1 interfaces and can operate as either one x4 link or bifurcate into four, x1 PCIe links automatically.  An optional x1 PCIe 2.0/1.1 link is also available for use with a Trenton IOB33 expansion module to a PICMG 1.3 backplane equipped with a PCIe Expansion Slot.

Video Interfaces

Analog Video Port – Located on the board’s I/O bracket and supports standard 15-pin VGA video cables.
 

Digital Video Port – Located on the THD8141 itself, this DVI-D port supports standard digital video cable connections.
 

Multiple video connections are an inherent system design advantage of Trenton’s THD8141 featuring the SHB’s processor options and the Intel® C226 chipset.  The Intel® HD Graphics P4600/4600 technology is featured in the graphics controller engine of these Haswell processor options.  This graphics engine supports a total of three memory interfaces with a range of maximum graphics frequencies and graphics video memory capacities.
 

The integrated graphics controller of the board’s processor dynamically utilizes a portion of the system memory based on the OS and the amount of memory installed.  Intel® HD Graphics P4600 is featured in the Intel® Xeon® E3-1200 v3 series processors while Intel® HD Graphics 4600 is part of the THD8141’s long-life Intel Core i7-4790S, Intel Core i5-4590S and Intel Core i3-4330TE processor options.  All processors support maximum video resolutions of 2560 x 1600 pixels.

Ethernet Interfaces

  • Intel® i350 Ethernet Controller – Two 10/100/1000Base-T on I/O Bracket Connectors
  • Intel® i217 Ethernet PHY – One 10/100/1000Base-T interface routed to SHB edge connector C*
     

*Use this backplane LAN interface in system applications that take advantage of the THD8141’s Intel® AMT 9.0 network management, out-of-band client system security, KVM remote system access and control plus many other network management capabilities supported by Intel® vPro and specifically Intel® AMT 9.0.  This LAN interface may be accessed either by connector P18 on the THD8141 or via the LAN interface connection on a PICMG® 1.3 backplane.

 

BP LAN Cable Option via P18 – You can build your own alternate backplane LAN cable using the instructions in the Jumpers, Connectors and Memory document for the THD8141 or you can take advantage on this third LAN interface by using the pre-made alternate backplane LAN cable with Trenton part number: 193500001150-00.

On Board Interfaces

Four USB 3.0 and Six USB 2.0 ports – The two on the I/O bracket, and two located on one of the dual-interface onboard headers support the USB3 device interface while one additional dual-interface onboard header and the four routed to SHB edge connector “C” for use on a PICMG 1.3 backplane support six USB2 interfaces.
 

All six SATA ports on the THD8141 support 600MB/s data transfers. In other words all ports support SATA Gen 3.0 devices.  The ports may be used for either independent SATA drive operation or in RAID 0,1,5 and 10 drive array system configurations.

 

Serial Port 1 header – RS422/RS485
RS485 interface configuration jumpers enable the following RS485 interface options:
1. full duplex without terminations
2. half duplex without terminations
3. full duplex with terminations
 

Serial Port 2 header – RS232
 

PS/2 Mouse header
 

PS/2 Keyboard header
 

PCI Express Mini Connector located on the rear of the board support industry standard PCIe Mini Cards

 

Optional IOB33 provides an additional x4 PCIe link to a backplane plus the following I/O expansion capabilities:

  • IOB33 I/O plate connectors – Two DB9 RS232 serial ports and one PS/2 MiniDin for PS/2 mouse & keyboard
  • IOB33 I/O header connectors – Parallel port, PS/2 keyboard and PS/2 mouse
     

(Note: The floppy port header on the IOB33 is not functional when using the IOB33 with the THD8141 SBC)

Watchdog Timer

The THD8141 provides a programmable watchdog timer with programmable timeout periods of 100 msec, 1 second, 10 seconds or 1 minute via board component U11.  When enabled the WDT (i.e. U11) will generate a system reset.  WDT control is supplied via the General Purpose IO pins from the Intel® C226 Platform Controller Hub (PCH).  The PCH’s GPIO_LVL2 register controls the state of each GPIO signal.  This 32-bit register is located within GPIO IO spaces.  The GPIO_BASE IO address is determined by the values programmed into the PCH’s LPC Bridge PCI configuration at offset 48-4B(h).
 

See the watchdog timer section in the specifications chapter of the THD8141 Hardware Manual for more detailed information and a WDT programming example.

Battery

Lithium – CMOS data retention

Mechanical

  • Board dimensions – 13.330” (33.86cm) L x 4.976” (12.64”cm) H
  • Standard cooling solution height – 2.15” (54.61mm)

Agency Approvals & Compliance

Designed for UL69050, CAN/CSA C22.2 No.60950-00, EN55022:1998 Class B, EN61000-4-2:1995, EN61000-4-3:1997, EN61000-4-4:1995, EN61000-4-5:1995, EN61000-4-6:1996, EN61000-4-11:1994

Mean Time Between Failures (MTBF)

MTBF – 234,190 Hrs Power-On Hours (POH) at 40° C per Bellcore

Power Requirements - 100% Stressed

Typical Values – 100% Stressed with 16GB of system memory

 

CPU Intel® Memory +5V +12V +3.3V
3.5GHz Xeon® E3-1275 v3 16GB 0.66A 7.39A 3.07A
3.2GHz Xeon® E3-1225 v3† 16GB 0.62A 6.13A 3.10A
2.3GHz Xeon® E3-1268L v3 16GB 0.59A 4.57A 3.08A
3.2GHz Core™ i7-4790Sˆ 16GB 0.57A 6.37A 3.11A
3.0GHz Core™ i5-4590S†ˆ 16GB 0.59A 4.84A 3.11A
2.4GHz Core™ i3-4330TE 16GB 0.58A 2.76A 3.09A

 

 

† = Processor option does not support Intel® Hyper-Threading

ˆ = Processor option does not support ECC memory

All processors are quad-core except the dual-core Intel® Core™ i3-4330TE.

All processors are long-life processors.

Power Requirements - Idle

Typical Values – Static Desktop (System Idle) with 16GB of system memory

 

CPU Intel® Memory +5V +12V +3.3V
3.5GHz Xeon® E3-1275 v3 16GB 0.55A 1.15A 2.63A
3.2GHz Xeon® E3-1225 v3† 16GB 0.48A 1.11A 2.62A
2.3GHz Xeon® E3-1268L v3 16GB 0.47A 1.16A 2.61A
3.2GHz Core™ i7-4790Sˆ 16GB 0.47A 1.11A 2.64A
3.0GHz Core™ i5-4590S†ˆ 16GB 0.48A 1.13A 2.66A
2.4GHz Core™ i3-4330TE 16GB 0.47A 1.37A 2.66A

 

 

† = Processor option does not support Intel® Hyper-Threading
 

ˆ = Processor option does not support ECC memory
 

All processors are quad-core except the dual-core Intel® Core™ i3-4330TE.
 

All processors are long-life processors.

Operating Temperature

Operating Temperature:  0-50° C with the standard cooling solution and 350LFM of continuous airflow for all processor options except the Intel® Xeon® E3-1275 v3.

 

NOTE: The maximum operating temperature for the THD8141 with the Intel® Xeon® E3-1275 v3 processor option installed with the standard cooling solution and 350LFM of continuous airflow across the board is 45° C.

Environmental

  • Airflow: 350LFM continuous airflow
  • Storage: -40° to 70° C.
  • Humidity: 5% to 90% non-condensing.

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U.S. Design & Assembly

U.S. Design & Assembly

Years in Business

Years in Business

Year Warranty

Year Warranty

Year Product Life Cycle

Year Product Life Cycle

The Trenton Difference

Trenton Systems designs, manufactures and integrates rugged computers and long-life components such as single board computers and PCI Express backplanes to create application-ready computing solutions that satisfy our customers' unique requirements for functionality, performance and reliability.