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November 2016 Newsletter
Windows 10 SHB (Secure Host Baseline) Operating System Mandate Is Coming. After January 31, 2017 a physically domain-joined computer running a Microsoft Windows based operating system in any Department of Defense application must support the Windows 10 SHB.
October 2016 Newsletter
A couple of different models of this popular 5U storage server are now available. The latest version is the new TSS5201 with integrated RAID controller cards that manage the bank of forty-eight (48) front access hot swap storage drives. Four internal drives are used for secure application software implementations and O/S storage.
September 2016 Newsletter
The TKL8255 is our latest single board computer to continue Trenton’s heritage of delivering the processing performance, dependability, and SBC longevity you count on to deliver stable computing hardware platforms.
August 2016 Newsletter
In this video the underlying technology in Trenton’s THS4095 4U rackmount computer is explained. This high density embedded computing system delivers wider system bandwidths and lower data latencies when integrating large numbers of today’s standard, off-the-shelf PCI Express plug-in cards.
July 2016 Newsletter
This latest Trenton Systems’ video demonstrates a simple and effective method of changing a system host board’s CMOS battery.
June 2016 Newsletter
How a new 5U Rackmount Computer (THS5095) supports “Lots of Slots” in a short-depth chassis is explained. Also, a new 2U Rackmount Computer (TWS2502) offers dual-processor value with “Lots of Drives” in a long-life 2U rackmount system architecture that you can depend on for long-term projects.
May 2016 Newsletter
This newsletter features two videos. In the first video the HDEC Series of system host boards and backplanes are explained by illustrating how Trenton has engineered a way to build upon the goodness of the PICMG® 1.3 standard by increasing the number of PCI Express lanes from a base of 20 lanes to 80 lanes with expansion up to 88 lanes built-in for future Intel® Xeon® 14nm (Skylake-EP) processor technology. The second video covers how to clear CMOS of a variety of Trenton Systems single board computers, system host boards and modular processor blades.
April 2016 Newsletter
Trenton Systems is now headquartered in a 52,000 sq. ft., state-of-the-art electronic manufacturing and engineering facility in the Atlanta, GA suburb of Lawrenceville. As Trenton System’s approaches its third decade, our product engineering, world-class customer support, technical sales, and marketing continues focusing on our company’s ever expanding array of industrial computers, GPGPU computing systems, MIL-STD certified and designed-to-meet military computers, video display wall controllers, single board computers, backplanes, and embedded motherboards.
March 2016 Newsletter
Trenton System’s HEP8225 system host board now supports the Intel Xeon E5-2600 v4 series of processors formally known as Broadwell-EP. Some of these long-life (embedded) Intel Xeon processor options feature 14 cores and 28 execution threads per processor providing a total of 28 cores and 56 threads per HEP8225 board. A 14nm processor die shrink down from the previous generation’s 22nm die allows for less power leakage in the chip, making the processor more efficient per watt of power consumed.
February 2016 Newsletter
Trenton’s engineering qualification team has documented an average benchmark performance increase of 24% across the key arithmetic computational metrics in apples-to-apples comparison testing for Intel Xeon E5-2600 v4 (i.e. Broadwell-EP) series of processors now available on the HEP8225 system host board. These processors feature a 14nm processor die shrink that delivers additional performance.
January 2016 Newsletter
Total storage capacity of the Trenton TRC2006 2U rackmount computer can easily exceed 50TB of data storage. The TRC2006’s small chassis footprint features eight (8) 3.5″ front access and hot-swap data storage drives. Two internal 2.5″ drives are ideal for securely locating the operating system and critical application software.
December 2015 Newsletter
The HDB8229 large form factor backplane is ideal for integrating large numbers of PCI Express option cards into a system powered by an HDEC Series SHB from Trenton, such as the HEP8225. The HDB8229 takes full advantage of the eighty (80) available PCI Express GEN3 links from the SHB. The HDB8229 option card slots support a wide variety of PCI Express plug-in cards including the latest GPUs such as the NVIDIA Tesla K80 GPU Accelerator. Trenton’s THS5087 rackmount computer is an ideal system solution for the HDB8229 backplane in applications that require expanded GPU and PCIe option card support.
November 2015 Newsletter
Trenton’s HEP8225 latest dual-processor single board computer represents a dramatic increase in SBC performance, and connectivity over previous SBC designs. System performance gains using the HEP8225 board are realized using the latest Intel Xeon E5-2600 series processors and by enabling native support for up to 80 lanes of PCI Express 3.0 to a backplane. This newsletter also discusses our HEP8225 bench marking test results available for detailed review in the HEP8225 Application Note on Performance Benchmarks.
October 2015 Newsletter
Trenton Systems introduces the MBS1000 1U modular blade server. This new product brings Trenton’s heritage of long-life, rugged single board computer designs to the 1U rackmount computer form factor. The resulting MBS1000 modular blade server maximizes system modularity, flexibility, hardware platform security and long-life 1U platform stability.
September 2015 Newsletter
The new integrated system configurator incorporated into Trenton Systems’ latest website update enables you to easily select the best single board computer, backplane and computer chassis combination for your specific application requirements. Background logic in the system configurator analyzes each selection made and automatically checks for any compatibility issues.
Trenton Systems’ individual product configurator works a lot like the integrated system configuator. The difference is that the individual product configurator doesn’t perform compatibility checks of the selected system sub-components allowing you to independently choose your single board computer, backplane, system chassis or embedded motherboard
August 2015 Newsletter
High Density Embedded Computing comprises an innovative set of new system host board, backplane and rackmount computer system technologies designed exclusively to solve large data throughput needs in signals intelligence, ground control, and industrial control applications. This guide focuses on how to efficiently implement these technologies in order to take full advantage of the ever increasing number of processor cores and native PCI Express 3.0 links available to the system designer.
July 2015 Newsletter
New 2U, 4U and 5U HDEC Series rackmount computers take full advantage of the expanded PCI Express 3.0 linking and system I/O capabilities made possible by Trenton’s HEP8225 system host board. These new Made In America embedded system solutions merge extensive networking, device I/O, and HDD/SDD capabilities into lightweight rugged aluminum chassis with built-in system fan speed control and system monitoring.
June 2015 Newsletter
Four new enables HDEC Series backplanes are now available to take full advantage of the performance advantages of Trenton’s HEP8225 system host board. The PCI Express 3.0 card slots are these backplanes increase data bandwidth and throughput speeds, while reducing latency to deliver enhanced system performance.
May 2015 Newsletter
The HEP8225 HDEC Series system host board is the first in a series of next generation single board computers to deliver eighty (80) PCI Express 3.0 interfaces to an HDEC Series® backplane using proven, high-density PCIe interconnect technology.
April 2015 Newsletter
The new TMS4710 2-in-1 MIL-STD Military Computer includes two independent single board computers, backplanes and power supplies all designed for longevity, software stability and operational performance. System configurations are available that are MIL-STD-810G and MIL-STD-461F certified.
February 2015 Newsletter
The HDEC Series design approach expands PCI Express and device I/O capabilities while increasing data throughput and reducing data latency. Intel Xeon E5-2600 v3 series processors form the underlying technology of the HDEC Series system host board while our family of HDEC Series backplanes support the added PCIe links.
January 2015 Newsletter
Memory latency is a key factor in overall single board computer performance, and benchmark tests have shown that Trenton’s THD8141 provides a 50% memory latency reduction when compared to previous generation Ivy Bridge processors.
Trenton Systems Newsletter Archive 2015 to 2016