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HDEC Backplanes Offer System Flexibility

by Tony Oliva, on Feb 10, 2018, 11:30:00 AM

The Trenton HDEC Series of Backplanes, System Host Boards and Systems represents a substantial increase in performance and throughput over previous interconnect methodologies, such as PICMG 1.3,   up to 125% more interconnects. This allows HDEC to provide a large number of PCI Express and device I/O interfaces.  Trenton continually evaluates market conditions and solicits customer input to design HDEC Backplanes which fulfill the requirements of demanding applications.

HDB8231 Offers 18 PCIe 3.0 Option Card Slots

To that end, Trenton Systems is proud to introduce the HDB8231 HDEC Series Large Format Backplane to the high performance computing market.  The HDB8231 is designed to leverage the eighty (80) lanes of PCI Express 3.0 provided by the 2, Intel Xeon E5-2600 v3 or v4 series of processors onboard a compatible SHB, such as the HEP8225.   The HDB8231's strength is its unique switchless architecture, which reduces cost and ensures low PCI Express latencies, compared to PICMG 1.3.  Eighteen (18) total PCIe 3.0 option card slots are supported: 2 - x8 electrical/x16 mechanical and 16 - x4 electrical/x16 mechanical.  A significant number of system I/O interfaces are routed to the backplane which streamlines system cable routing, improving airflow, which, ultimately, extends system life.  The backplane fully supports the PCI Express auto-training function, affording system flexibility in option card selection, offering support for standard, PCIe 3.0, 2.0 or 1.1 option cards operating at various PCIe electrical interface link widths such as x16, x8, x4 or x1.  Contact us today for more information about utilizing the HDB8231 in your high-performance computing application.

New HDB8259 Solves GPGPU Computing Challenges

Additionally, as part of our desire to help our customers meet and exceed their application requirements, Trenton is developing a new, customer-driven computing solution based on our HDB8229 backplane, the HDB8259.  The most compelling feature of the HDB8259 is the I2C bus isolation on all of the fourteen (14) PCIe 3.0 card slot interfaces.  This allows independent polling of card status information via the I2C bus which can be critical in many applications, namely GPGPU computing, where monitoring of system option cards provides vital system health information, such as current utilization and core temperature.  Like all of our HDEC Backplanes, the HDB8259 will support the HEP8225 SHB and its eighty (80) lanes of PCIe 3.0 for effective high performance computing.  Additional design features to ease GPGPU deployment include support for extended-current power sources and onboard control of system chassis fans.

Trenton is an NVIDIA Preferred Solution Provider.  We can help you address your high performance GPGPU computing challenges with ease.  Contact Trenton today for more information on this exciting upcoming computing solution or how we can help you achieve your high performance computing goals.  As always, our engineers can design a computing solution to meet any application requirement.

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